Chemical Vapor Deposition

Results: 260



#Item
121Materials science / Thin film deposition / MOSFET / Chemical vapor deposition / Low-k dielectric / Silicide / Titanium nitride / Metal gate / Copper interconnect / Chemistry / Semiconductor device fabrication / Technology

NANOCHIP Technology Journal EXTENDING COPPER INTERCONNECT

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Source URL: www.appliedmaterials.com

Language: English - Date: 2014-01-26 17:00:01
122Plasma / Fusion power / Nonthermal plasma / Incineration / Air pollution / State of matter / Atmospheric-pressure plasma / Anisothermal plasma / Plasma-enhanced chemical vapor deposition / Plasma physics / Physics / Optical materials

environment copy:Environment[removed]

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Source URL: www.plasmacoalition.org

Language: English - Date: 2006-08-08 21:54:18
123Chemistry / Materials science / Epitaxy / MOSFET / Solar cell / Amorphous silicon / Chemical vapor deposition / Heterojunction / Thin film solar cell / Semiconductor device fabrication / Technology / Thin film deposition

EFFECT OF DEFECT-RICH EPITAXY ON CRYSTALLINE SILICON / AMORPHOUS SILICON HETEROJUNCTION SOLAR CELLS AND THE USE OF LOW-MOBILITY LAYERS TO IMPROVE PEFORMANCE Michael G. Deceglie and Harry A. Atwater Thomas J. Watson Labor

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Source URL: daedalus.caltech.edu

Language: English - Date: 2012-04-18 11:56:03
124Semiconductor device fabrication / Nanomaterials / Chemical vapor deposition / Catalysis / Silicon carbide / Carbon / Carbon Nanotubes Supported Catalyst / Carbon nanofiber / Chemistry / Manufacturing / Carbon nanotubes

Exploring the Mechanism of Nanotube Formation Burhanettin Çiçek Ankara University, Chemical Engineering Department, Ankara Turkey Carbon nanotubes (CNT) have attracted vast interest due to their excellent mechanical, p

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Source URL: www.jst.go.jp

Language: English - Date: 2010-04-18 22:29:20
125Microtechnology / Chemical-mechanical planarization / Etching / Back end of line / Copper interconnect / Through-silicon via / Wafer / Chemical vapor deposition / Three-dimensional integrated circuit / Semiconductor device fabrication / Electronics / Technology

Robust TSV Via­Middle and Via­Reveal Process Integration Accomplished through Characterization and Management of Sources of Variation

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Source URL: www.appliedmaterials.com

Language: English - Date: 2014-05-27 18:47:55
126Chemical vapor deposition / Carbon / Vapor / Chemistry / Carbon nanotubes / CH4

Thermodynamic Analysis and Synthesis of Carbon Nanotubes by Chemical Vapor Deposition Using NiO Catalyst and Methane M.C. Altay, S. Eroglu Istanbul University, Faculty of Engineering, Dept. Metallurgical and Materials En

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Source URL: www.jst.go.jp

Language: English - Date: 2010-04-22 23:11:55
127Coatings / Manufacturing / Matter / Chemical vapor deposition / Plasma processing / Vacuum / Titanium nitride / Semiconductor device fabrication / Chemistry / Thin film deposition

Microsoft Word - CVD Co Capping Layers.doc

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Source URL: www.appliedmaterials.com

Language: English - Date: 2014-05-12 14:29:49
128Coatings / Technology / Semiconductor device fabrication / Nanomaterials / Vapor–liquid–solid method / Sputtering / Chemical vapor deposition / Gold / Ion track / Chemistry / Materials science / Microtechnology

NANO LETTERS Secondary Ion Mass Spectrometry of Vapor-Liquid-Solid Grown, Au-Catalyzed, Si Wires

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Source URL: daedalus.caltech.edu

Language: English - Date: 2008-09-05 14:51:02
129Ceramic materials / Abrasives / Nitrides / Carbon nanotubes / Boron nitride / Silicon carbide / Boron / Chemical vapor deposition / Chemistry / Matter / Superhard materials

NASA Aeronautics Research Institute Aligned Boron Nitride Nanotube Forests for Thermal Management Janet Hurst, RXC NASA GRC

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Source URL: nari.arc.nasa.gov

Language: English - Date: 2014-10-17 18:19:23
130Electronic engineering / High-k dielectric / Chemical vapor deposition / Reliability engineering / Reliability / Titanium nitride / IMEC / Semiconductor device fabrication / Technology / Chemistry

Impact of Barrier Integrity on Liner Reliability in 3D Through Silicon Vias Yunlong LI1, Yann CIVALE1, Yoshiyuki OBA2, Andrew COCKBURN3, Jin Hee PARK4, Eric BEYNE1, Ingrid DE WOLF1,5, Kristof CROES1 1

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Source URL: www.appliedmaterials.com

Language: English - Date: 2014-05-27 18:46:11
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